Customization: | Available |
---|---|
Production Scope: | Product Line |
Automation: | Automatic, Automation |
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Audited by an independent third-party inspection agency
Inspection Object |
Skew / Tombstone / Wrong part / Missing / Overturning / Damaged / Cold joint / insufficient solder / Excess solder |
Inspection Component |
0402 chip , IC pitch 0.3mm, wave soldering point |
Inspection Method |
Artificial Intelligence and Pattern Recognition |
Camera |
Color CCD (1.45MPa Pixels), Resolution 20um, FOV 20x20mm (customized) Image processing <=2000m2/s |
Light Source |
RGB Ring Multi-angle LED combination lighting, high brightness, standard CCTV lens, DOV 2mm |
Computer |
CPU : Dual-core 2.7G, RAM: DDRIII-2G harddisk : 500G, 22" wide screen LCD |
PCB Thickness |
0.3 - 5.0 (PCB Warpage < 5mm) |
PCB Height |
SMT : Top: 30mm, Bottom 45mm (can be customized) |
Driving Method |
AC Servo Motor+ball screw rod+linear guide rail |
Motion Speed |
Max 700mm/s |
PCB Clamp |
Automatic |
Power |
AC220V / 50Hz, UPS 1000W |
Dimension |
940 x 950 x 1280 mm |
Weight |
Aprox. 450kg |
Keep attending more than 10 exhibitions and forums each year. |
The annual NEPCON and Electronica exhibitions are our regular event. |
Participate in 3-5 overseas famous exhibitions regularly every year, like: |
IPC Expo in San Diego, US |
Electronica in Delhi, India |
Electron Tech Expo in Mosco, Russia |
WIN Exhibition in Istanbul, Turkey |