Full Hot Air Reflow Oven machine with Siemens PLC
Our mainly products: wave solder, reflow oven, SMT conveyor, pick and place machine, screen printer, LED line, PCB Loader and unloader, SMD oven ect.
Shenzhen Jaguar Automation Equipment Co.,Ltd is one of the leaders in SMT machine in China.
Then what we can do for you if you want to set up a SMT factory?
1. we can provide full SMT solution.
2. we can provode you with top technical support.
3. we have enrich experience on SMT factory set up.
4.we can provide the best professional tech service.
5.we can help you to deal with all the trouble about SMT.
|Outside dimension||6000 X 1400 X 1600mm|
|Standard color||Computer grey|
|Number of heating zones||Up10/bottom10|
|Length of heating zones||3750mm|
|Number of cooling zones||2 |
|Exhaust volume||10M³/min*2 exhausts|
|Power supply||5line, 3phase, 380V 50/60Hz|
|Power for warm up||58KW|
|Heating pattern||Up & Bottom Hot air|
|Warming time||Approx. 20minutes|
|Temp. setting range||Room temp-350 degree|
|Control system||PLC+ Computer|
|Temperature control method||PID close loop control +SSR driving|
|Temperature control precision||± 1.0degree|
|Temperature deviation on PCB||± 1-2 degree|
|Data storage||Process data and status storage (80GB)|
|Abnormal alarm||Abnormal temperature (extra-high/extra-low temp.)|
|Board dropped alarm||Tower light: yellow warming: Green-normal: Red-abnormal|
|Max. width of PCB||450mm|
|Rail Number||1 Lane Or 2 Lane (option)|
|Components clearance||Top/bottom clearance of PCB is 25mm|
|Conveyor height||Light → right(option: R→ L)|
|PCB transmission agent||chain +mesh|
|Conveyor height||900± 20mm|
|Conveyor speed range||0~2000mm/min|
1. Windows XP O/S, so simply as Chinese and English interface onscreen alternative available.
2. The digital control system adopted with PLC +Modular circuit to stabilized and accurate of repetitive precision.
3. Intelligent diagnosis system (IDS) has the function of trouble remind, alarm, list-out, report saving.
4. Temperature and blower speed controlling adjustable independently, to meet the high-precision requirements.
5. To minimize the temperature difference of various volumes of components by newly chambers design, with enhance the reliability and protective of each solder joints.
6. Step forced cooling system to easily achieve the requirements of strict lead-free processes (cooling slope: ≥ 3degree/sec.)
7. Center support and dual rail is optional.