Guangdong, China
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Selective Wave Soldering Machine, SMT Soldering Machine, Selective Wave Soldering manufacturer / supplier in China, offering Selective Wave Soldering Machine Model Number: OS-400c (offline), Inline Pick and Place Machine for SMD Mounting (Top-10), SMT Pick and Place Machine Placement Machine Chip Shooter (Top-10) and so on.

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Supplier Homepage Products lead free reflow oven machine Selective Wave Soldering Machine Model Number: OS-400c (offline)

Selective Wave Soldering Machine Model Number: OS-400c (offline)

Get Latest Price
Min. Order / Reference FOB Price
1 Piece US $1-1.1/ Piece
Port: Shenzhen, China
Production Capacity: 100PCS/Month
Payment Terms: T/T
Precision: Precision
Certification: CE, ISO
Demoulding: Slide
Heating System: Electric
Function: Lubrication
Mould Life: <300,000 shots

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Basic Info

Model NO.: Jaguar Selective wave soldering machine
Automatic Grade: Automatic
Condition: New
Customized: Customized
Warranty: 12 Months
Machine Size: L850mm X W1100mm X H1340mm
Total Power: 5kw
Running Power: 1-3kw
Weight: 200kg
Air Requirement: 3-5 Bars 8-12L/Min
Nitrogen Requirement(Option): 3-4 Bars Over
Nitrogen Purity Requirement(Option): 99.998
Pumping Air Volume Requirements: 500-800cmb/H
Fixture: Can Be Used If Needed
Fixture Max Size: 420*420mm
Trademark: Jaguar
Transport Package: Wooden Case
Specification: CE
Origin: Shenzhen, China
HS Code: 85151900

Product Description

Selective wave soldering machine
model number:OS-400C(offline)
Work process:
Manual put down plate---spray flux--- pcb move to preheating--- pcb selective soldering---take away pcb
1.Full function offline machine with small occupation.
2.PCB moved, spray and soldering platform fixed.
3.High quality soldering.
4.Machine could be placed on a production line, easy to set up a new line.
5.PC control, parameters could be set and saved in the computer. All data can be traced back and store.
Component 1: Machine software system
1. With completely independent Intellectual property rights of soldering software,combined with many years selective soldering skill and experience, based on the development of the Window software function, machine will be more easy to operate and good traceability.
2.the PCB scanning images can be used for the path programming, the path to the starting point, the welding speed, idle motion speed, height of Z axis, wave height, etc. can be set on the computer.
the real-time display of welding process. Through the camera, the welding process can give the feedback to the machine external independent display.
can be upgraded to take MARK point positioning and the frequency of use.
Component 2: motion platform system:
main motion platform design with lightweight, improve the running speed and make sure the platform rigidity.
Panasonic servo driver and motor provided with power for the movement. grinding lead screw and linear guide make the direction so that with advantages positioning precision, low noise, smooth movement.
3.Motion platform with dust shield in order to prevent the dirt drop into the lead screw.
Component 3: Spray Part
Nozzle adopt Japanese origin spray nozzle with advantages of good spray effect, not easy to blockage and suitable for various flux.
2. Flux use pressure tank storage made sure the spary pressure stable. Reduce the bad affect by the quantity of flux.n
Component 4: Preheating Part
1. IR(infrared) heating, position can be adjustable.
2.heating rate can adjust by the computer.
Component 5: selective solder part
1.Solder pot temperature, Nitrogen temperature, wave height ect can be set by computer.
2.Solder tank is made of alloy. External type heating plate, uniform heat transfer.
3.solder pot adopt flexible connection wires, make sure no need to rewiring when we change another pot.
4.Nitrogen on-line heating devices ensure good wettability and reduce oxide.
5.Solder pot is with liquid level alarm system.
Component 6: PCB put down and take out
1.Manual put down and take out
2.PCB fix position by the clamp device
Component 7. Machine Shell
1.The whole steel structure, added the base board at the bottom in order to increase the stability and reduce the shaking.
2.Machine surface use industrial paint.
Model NumberOS-400C
Machine sizeL850mm X W1100mm X H1340mm
Total power5KW
Running power1-3kw
Air requirement3-5 Bars 8-12L/min
Nitrogen requirement(option)3-4 bars ove
Nitrogen purity requirement(option)99.998%
Pumping air volume requirements500-800cmb/h
Fixture and PCB
FixtureCan be used if needed
Fixture max size420*420mm
Max soldering size400*400mm
PCB thickness0.2-6mm
PCB board edge sizeOver 3mm
Control system and operation
Control methodPC
PCB put and takemanual
Operate height900±30mm
Component max heightUp 50mm/ bottom 30mm
Motion platform
Motion axisX Y Z
Motion controlClose loop servo control
Motion motorPanasonic motor and servo
Position accuracy±0.1mm
lead screwgrinding lead screw
Rosin Flux Control
Spray NozzleJapanese origin spray nozzle
Spray durabilityStainless steel
Flux capacity1L
Flux containerpressure tank
alcohol capacity1L
alcohol containerpressure tank
Heating Part
Heating methodIR
Heating power3kw
Tempt. range25-240ºC
Solder pot part
Solder pot quantity1
Solder capacity15kg
Control systemPID
Melting time20-30mins
Max solder tempt.350ºC
Solder pot power1.2kw
Solder Nozzle
MaterialAlloy steel
Standard Solder Nozzle5pcs/pot(inner diameter:2.5mm,3mm,4mm,5mm,6mm)
Nitrogen Control(option)
Heating NitrogenStandard
Nitrogen PID control0-350ºC
Nitrogen Consumption/solder nozzle1-2 /solder nozzle


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