Selective wave soldering machine
Manual put down plate---spray flux--- pcb move to preheating--- pcb selective soldering---take away pcb
1.Full function offline machine with small occupation.
2.PCB moved, spray and soldering platform fixed.
3.High quality soldering.
4.Machine could be placed on a production line, easy to set up a new line.
5.PC control, parameters could be set and saved in the computer. All data can be traced back and store.
Component 1: Machine software system
1. With completely independent Intellectual property rights of soldering software,combined with many years selective soldering skill and experience, based on the development of the Window software function, machine will be more easy to operate and good traceability.
2.the PCB scanning images can be used for the path programming, the path to the starting point, the welding speed, idle motion speed, height of Z axis, wave height, etc. can be set on the computer.
the real-time display of welding process. Through the camera, the welding process can give the feedback to the machine external independent display.
can be upgraded to take MARK point positioning and the frequency of use.
Component 2: motion platform system:
main motion platform design with lightweight, improve the running speed and make sure the platform rigidity.
Panasonic servo driver and motor provided with power for the movement. grinding lead screw and linear guide make the direction so that with advantages positioning precision, low noise, smooth movement.
3.Motion platform with dust shield in order to prevent the dirt drop into the lead screw.
Component 3: Spray Part
Nozzle adopt Japanese origin spray nozzle with advantages of good spray effect, not easy to blockage and suitable for various flux.
2. Flux use pressure tank storage made sure the spary pressure stable. Reduce the bad affect by the quantity of flux.n
Component 4: Preheating Part
1. IR(infrared) heating, position can be adjustable.
2.heating rate can adjust by the computer.
Component 5: selective solder part
1.Solder pot temperature, Nitrogen temperature, wave height ect can be set by computer.
2.Solder tank is made of alloy. External type heating plate, uniform heat transfer.
3.solder pot adopt flexible connection wires, make sure no need to rewiring when we change another pot.
4.Nitrogen on-line heating devices ensure good wettability and reduce oxide.
5.Solder pot is with liquid level alarm system.
Component 6: PCB put down and take out
1.Manual put down and take out
2.PCB fix position by the clamp device
Component 7. Machine Shell
1.The whole steel structure, added the base board at the bottom in order to increase the stability and reduce the shaking.
2.Machine surface use industrial paint.
|Machine size||L850mm X W1100mm X H1340mm|
|Air requirement||3-5 Bars 8-12L/min|
|Nitrogen requirement(option)||3-4 bars ove|
|Nitrogen purity requirement(option)||99.998%|
|Pumping air volume requirements||500-800cmb/h|
|Fixture and PCB|
|Fixture||Can be used if needed|
|Fixture max size||420*420mm|
|Max soldering size||400*400mm|
|PCB board edge size||Over 3mm|
|Control system and operation|
|PCB put and take||manual|
|Component max height||Up 50mm/ bottom 30mm|
|Motion axis||X Y Z|
|Motion control||Close loop servo control|
|Motion motor||Panasonic motor and servo|
|lead screw||grinding lead screw|
|Rosin Flux Control|
|Spray Nozzle||Japanese origin spray nozzle|
|Spray durability||Stainless steel|
|Flux container||pressure tank|
|alcohol container||pressure tank|
|Solder pot part|
|Solder pot quantity||1|
|Max solder tempt.||350ºC|
|Solder pot power||1.2kw|
|Standard Solder Nozzle||5pcs/pot(inner diameter:2.5mm,3mm,4mm,5mm,6mm)|
|Nitrogen PID control||0-350ºC|
|Nitrogen Consumption/solder nozzle||1-2 /solder nozzle|