| Customization: | Available |
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| Application: | Electrical & Electronics Industry |
| Certification: | CE, ISO, CCC |
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Work process:
Manual put down plate---spray flux---pcb move to preheating--- pcb selective soldering---take away pcb| Model Number | OS-400C |
| General | |
| Machine size | L850mm X W1100mm X H1340mm |
| Total power | 5KW |
| Running power | 1-3kw |
| Weight | 200kg |
| Air requirement | 3-5 Bars 8-12L/min |
| Nitrogen requirement(option) | 3-4 bars over 2/h |
| Nitrogen purity requirement(option) | 99.998% |
| Pumping air volume requirements | 500-800cmb/h |
| Fixture and PCB | |
| Fixture | Can be used if needed |
| Fixture max size | 420*420mm |
| Max soldering size | 400*400mm |
| PCB thickness | 0.2-6mm |
| PCB board edge size | Over 3mm |
| Control system and operation | |
| Control method | PC |
| PCB put and take | manual |
| Operate height | 900±30mm |
| Component max height | Up 50mm/ bottom 30mm |
| Motion platform | |
| Motion axis | X Y Z |
| Motion control | Close loop servo control |
| Motion motor | Panasonic motor and servo |
| Position accuracy | ±0.1mm |
| lead screw | grinding lead screw |
| Rosin Flux Control | |
| Spray Nozzle | Japanese origin spray nozzle |
| Spray durability | Stainless steel |
| Flux capacity | 1L |
| Flux container | pressure tank |
| alcohol capacity | 1L |
| alcohol container | pressure tank |
| Heating Part | |
| Heating method | IR |
| Heating power | 3kw |
| Tempt. range | 25-240ºC |
| Solder pot part | |
| Solder pot quantity | 1 |
| Solder capacity | 15kg |
| Control system | PID |
| Melting time | 20-30mins |
| Max solder tempt. | 350ºC |
| Solder pot power | 1.2kw |
| Solder Nozzle | |
| Material | Alloy steel |
| Standard Solder Nozzle | 5pcs/pot(inner diameter:2.5mm,3mm,4mm,5mm,6mm) |
| Nitrogen Control(option) | |
| Heating Nitrogen | Standard |
| Nitrogen PID control | 0-350ºC |
| Nitrogen Consumption/solder nozzle | 1solder nozzle |